1993 International Symposium on Microelectronics: Proceedings : 9-11 November, 1993, Dallas Convention Center, Dallas, TexasThe Society, 1993 - 719 pages |
Table des matières
20 | 4 |
3D Green Tape Planar Langmuir Sensor Structures | 20 |
A Pressure Sensor Comprised of Diamond J L Davidson | 26 |
Droits d'auteur | |
57 autres sections non affichées
Expressions et termes fréquents
achieved addition adhesive allows applications assembly bond capacitor ceramic chip circuit cleaning coating components conductive conductor conventional cost crack cycling defect density deposition determined developed diamond dielectric display effect electrical electronic etching experiments fabrication factor failure Figure firing flux formed glass Green heat higher hybrid improvement increase initial interconnect joint laser layer lead limit manufacturing material measured mechanical metal method Microelectronics observed oxide package pads paste pattern performance pitch plating polyimide powder present printed probe problem production properties range reduced reliability removed residue resistance resistor samples selected sensor shown in Figure shows silver sintering solder solution strain strength stress structure substrate surface Table tape temperature thermal thick film thickness thin typical values volume wire