1993 International Symposium on Microelectronics: Proceedings : 9-11 November, 1993, Dallas Convention Center, Dallas, TexasThe Society, 1993 - 719 pages |
À l'intérieur du livre
81 pages contenant surface dans ce livre
Où puis-je trouver l'intégralité de ce livre ?
Résultats 1-3 sur 81
Table des matières
20 | 4 |
3D Green Tape Planar Langmuir Sensor Structures | 20 |
A Pressure Sensor Comprised of Diamond J L Davidson | 26 |
Droits d'auteur | |
52 autres sections non affichées
Expressions et termes fréquents
alumina anorthite applications assembly bump capacitance capacitor carrier ceramic charge amplifier circuit cleaning coating cofired components conductive adhesives conductor contact resistance copper crack crosstalk CVDD density deposition developed diameter diamond dielectric effect electrical encapsulant etching evaluation fabrication factor firing flip chip flux residue glass glass-ceramic Green Tape heat hybrid increase interconnect interface JFET laminate laser layer LTCC manufacturing material MCM-D measured mechanical metal load method Microelectronics microns MLC connector multilayer oxide pads parameters Parylene paste rheology pattern performance photoresist pitch plasma plating polyimide powder printed probe Proc properties reflow reliability resistor samples sensor shown in Figure shows shrinkage silicon silver sintering solder balls solder joint solder paste strain stress structure substrate Table tack techniques temperature thermal conductivity thermal cycling thick film thin film through-hole trim typical values wire bond